2026 Showcase

2026 OFC


Welcome to the NextGenInfra OFC 2026 Showcase. With the recent AI boom, optical is hot again. This year's OFC saw close to 18,000 attendees from all over the world. NextGenInfra was on site at the LA Convention Center and grabbed tons of videos from leading thinkers in the optical space — vendors, carriers, hyperscalers, data center operators. Whether your interest is 800G, 1.6T, coherent-lite, pluggables, CPO, XPO, we have something for you!
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Data Center Networking in 2026 — Scaling to New Heights

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Analysis by AvidThink

What we learned at OFC 2026

Across 30 interviews on the show floor in Los Angeles, five themes define where optical networking for AI is heading.

  1. 1.6T is shipping — and 3.2T is already in sight

    Broadcom's Tomahawk 6 is in volume production with 64 ports of 1.6Tbps, its Taurus DSP is the first at 400 Gbps per lambda, and Acacia has shipped over 25,000 units of its 1.6T portfolio. With VIAVI and Keysight demonstrating 1.6T test and multi-vendor interop, 1.6T moved from demo to deployment this year — and the DSP roadmap already points to 3.2T transceivers.

  2. Co-packaged optics crossed the credibility threshold

    The reliability question that stalled CPO is being answered with field data: Meta's trials of Broadcom CPO logged 50 million hours of link flap-free operation, and Lumentum's 800mW ELSFP external lasers address the serviceability objection. Reliability is now argued as CPO's advantage, not its risk.

  3. Scale-up inside the rack goes optical — with standards

    The new OCI MSA — wavelength division with four colors of light per direction instead of serial PAM4 — targets scale-up networks, with Broadcom and Xscape Photonics among the backers. Combined with the Ethernet for Scale-Up Networking 1.0 spec expanding racks from 64–128 XPUs to 1K, the rack interconnect is the industry's new battleground.

  4. Optical circuit switching arrives at rack scale

    iPronics showed a silicon photonics OCS that reconfigures 1000x faster than prior solutions with a 64x64 chip already fabricated, and Salience Labs demonstrated a 32-port fully non-blocking optical crossbar. Vendors are openly calling 2026 the breakout year for all-optical switching where electronic packet switching can't keep up.

  5. Scale-across: AI clusters now span buildings and campuses

    Distributed training is pulling coherent optics out of the long haul: Ciena's WaveLogic 6 targets geographically distributed AI training, Nokia's half-petabit 7250 EXR18 lets multiple sites operate as one cluster, and Marvell's 800G coherent-lite O-band module covers campus DCI up to 20 km. The data center boundary is dissolving.

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Highlights from industry thought leaders

Video interviews

1Finity

1Finity Ultra Optical System OLS Built for the AI Era

  • 1Finity (Fujitsu) launches L1000 and L2000 ultra optical systems targeted at the AI era
  • Compact modular designs span DCI, metro, long-haul, and edge access ROADM applications
  • Positioned on lower cost per bit per kilometer and network sustainability
Abstract
Joe Mocerino, Principal Solutions Architect at 1Finity, a Fujitsu company, presents the newly launched L1000 and L2000 ultra optical systems designed as a fundamental foundation for the AI era, addressing high-capacity traffic demands, lower cost per bit per kilometer, and network sustainability through compact modular designs supporting DCI, metro, long-haul, and edge access ROADM applications.
Acacia

Acacia's 1.6T Transceivers for AI Infrastructure

  • Acacia's 1.6T transceiver portfolio targets AI infrastructure scale-out applications
  • Scale-across architectures are driving demand for 800G coherent solutions
  • Over 25,000 units already shipped
Abstract
Per Hansen, Product Manager at Acacia, discusses the company's 1.6T transceiver portfolio for AI infrastructure scale-out applications and the growing adoption of scale-across architectures driving demand for 800G coherent solutions, with over 25,000 units already shipped.
Broadcom

Unpacking the New OCI MSA Optical Standard

  • New OCI MSA optical standard targets scale-up networks
  • Uses wavelength division with four colors of light per direction instead of serial PAM4 lanes
  • Reduces latency, power, and cost versus high-speed serial approaches
Abstract
Near Margalit, GM and VP of Optical Systems Division at Broadcom, presents the newly released OCI MSA optical standard for scale-up networks at OFC26, which reduces latency, power, and cost by utilizing wavelength division technology with four colors of light in each direction instead of high-speed serial PAM 4 lanes.
Broadcom

Big News for CPO - Reliability, Availability, Serviceability

  • Meta trials of Broadcom CPO achieved 50 million hours of link flap-free operation
  • CPO's highly integrated architecture and high-volume manufacturing deliver superior RAS
  • Reliability positioned as a key advantage of co-packaged optics
Abstract
Manish Mehta, VP Marketing, Optical Systems Division at Broadcom, discusses the company's co-packaged optics (CPO) technology demonstrated at OFC, including Meta's announcement of trials achieving 50 million hours of link flap-free operation. He explains that CPO's highly integrated architecture and high-volume manufacturing processes deliver extremely reliable optical links with superior RAS performance.
Broadcom

Building at Scale: Ethernet & Optics

  • Ethernet for Scale-Up Networking Group 1.0 spec expands racks from 64-128 XPUs to 1K XPUs
  • Tomahawk 6 in volume production: first with 64 ports of 1.6Tbps, 200G SerDes and CPO
  • New Jericho 4 enables cross-data center cluster deployment; Broadcom joins OCI MSA
Abstract
Hasan Siraj, VP of Product Management in the Core Switching Group at Broadcom, highlights the Ethernet for Scale-Up Networking Group's 1.0 specification and rack expansion from 64-128 XPUs to 1K XPUs. He also announces Tomahawk 6 shipping in volume production as the first to support 64 ports of 1.6Tbps with 200G SerDes and CPO, the company's participation in the OCI MSA, and the new Jericho 4 enabling cross-data center cluster deployment.
Broadcom

Broadcom's 400G/Lane Taurus Optical DSP

  • Taurus is the industry's first 400 Gbps-per-lambda PAM4 optical DSP
  • Enables low-cost, low-power 1.6T transceivers and a path to 3.2T transceivers
  • Targets 200 terabit switch networking systems for AI infrastructure
Abstract
Gang Qiu, Product Line Manager, Marketing at Broadcom, presents Taurus, the industry's first 400 gigabit per lambda PAM4 optical DSP designed to help customers scale AI infrastructure at OFC 2026. The solution enables next-generation low-cost, low-power 1.6 terabit transceivers and paves the path to 3.2 terabit transceivers in 200 terabit switch networking systems.
Broadcom

Broadcom's 3.5D Silicon

  • Broadcom's 3.5D silicon stacks two compute dies face-to-face on an interposer, beyond standard 2.5D
  • First 3.5D product now shipping to Fujitsu
  • Technology being adopted across all major XPU partners
Abstract
Harish Bharadwaj, VP of Marketing for the ASIC Product Division at Broadcom, discusses the company's 3.5D silicon technology that stacks two compute dies face-to-face on an interposer, advancing beyond the industry's standard 2.5D approach. Broadcom is now shipping its first 3.5D product to Fujitsu, with the technology being adopted across all major XPU partners.
Ciena

GPU Cluster Connectivity

  • Ciena Nitro linear retimer driver targets active copper cables for GPU cluster interconnects
  • Vesta 200 is a 6.4T CPX optical engine for high-capacity AI networks
  • Positioned as flexible, power-efficient connectivity options
Abstract
Helen Xenos, Senior Director of Portfolio Marketing at Ciena, presents the company's innovations for GPU cluster interconnects at OFC, including the Nitro linear retimer driver for active copper cables and the Vesta 200 6.4T CPX optical engine. These solutions provide flexible, power-efficient connectivity options to help customers build high-capacity networks for modern AI infrastructure.
Ciena

The New Scale-Across Architecture

  • Ciena scale-across architectures target geographically distributed AI training
  • New WaveLogic 6 Nano performance modes added to coherent optical pluggables
  • Roadmap advances toward 1600 ZR and ZR+ technologies
Abstract
Mark Bieberich, Vice President of Product Marketing at Ciena, discusses the company's scale-across architectures for geographically distributed AI training, featuring next-generation coherent optical pluggables, new WaveLogic 6 Nano performance modes, and a roadmap toward 1600 ZR and ZR+ technologies.
Cisco Systems

800G Optics, Multi-Rail Systems & Supply Chain Planning

  • Cisco multi-rail optical line systems support 128 fibers in a single rack
  • New 12.8 terabit transponder uses 800-gig pluggable optics
  • Cisco positions leadership in coherent pluggable optics for AI infrastructure
Abstract
Bill Gartner, SVP & GM, Optical Systems and Optical Business Unit at Cisco Systems, presents the company's optical innovations at OFC, including multi-rail optical line systems supporting 128 fibers in a single rack and a new 12.8 terabit transponder with 800-gig pluggable optics. He highlights Cisco's leadership in coherent pluggable optics for AI infrastructure.
Ethernet Alliance

Ethernet Evolves to Meet AI's Massive Demands

  • IEEE 802.3dj project is nearly complete, with future work on 400G signaling
  • Ethernet is adapting across electrical chips, optical chips, connectors, cabling, and packaging
  • Standards-driven evolution positioned as key to keeping pace with AI demands
Abstract
John D'Ambrosia, Chair, IEEE P802.3dj Task Force and Chair Emeritus of the Ethernet Alliance describes how the industry is advancing through standards including the nearly complete 802.3 DJ project and future 400G signaling. He emphasizes that Ethernet continues to adapt across electrical chips, optical chips, connectors, cabling, packaging, and heat management.
Ethernet Alliance

Ethernet's Critical Role for AI Infrastructure

  • AI-driven demand is straining supply chains for chips, power, and fiber
  • Ethernet Alliance argues Ethernet's reliability track record makes it the only viable AI connectivity solution
Abstract
Peter Jones, Chair of the Ethernet Alliance, presents at OFC 2026 on how Ethernet technology must address unprecedented AI-driven infrastructure demands that are straining supply chains for chips, power, and fiber. He emphasizes that despite these immense challenges, Ethernet's proven track record of reliability makes it the only viable solution for enabling the industry's AI connectivity requirements.
Ethernet Alliance

Ethernet Alliance: Ethernet Simply Works

  • Six Ethernet Alliance leaders across product, technical, and standards roles deliver one message: Ethernet simply works.
  • Ethernet's dependable performance across diverse applications keeps it the default choice as speeds and use cases multiply.
Abstract
Keith Cole, GM & VP of Product Marketing, Peter Jones, Chair, Tim Crawley, Product Marketing Engineer, David Rodgers, Technical Business Development Manager, Anabel Alarcon, Product Line Manager, and Vijay Murthy, Senior Technical Product Manager, from the Ethernet Alliance present a unified message about Ethernet technology's reliability and effectiveness. The presenters collectively reinforce that Ethernet consistently delivers dependable performance across diverse applications.
Ethernet Alliance

Ethernet for AI — It Just Works… David Rodgers

  • Ethernet Alliance booth demonstrates multi-vendor interoperability of Ethernet for AI
  • Interop spans 1.6 terabit solutions alongside 800 gig and 400 gig technologies
Abstract
David Rodgers, Technical Business Development Manager at Ethernet Alliance, presents from the organization's booth at the Optical Fiber Conference 2026 in Los Angeles, where member participants demonstrate interoperability of Ethernet for AI with 1.6 terabit solutions alongside 800 gig and 400 gig technologies.
EXFO

AI Infrastructure Form Factors & Coherent Transceivers at OFC 2026

  • OSFP-RHS form factor targets higher-density AI deployments
  • Coherent transceiver technology gaining adoption for GPU-to-switch connectivity
Abstract
Anabel Alarcon, Product Line Manager at EXFO, presents key trends at the Ethernet Alliance booth at OFC 2026, including OSFP-RHS for higher density AI deployments and the growing adoption of coherent transceiver technology for GPU-to-switch connectivity.
iPronics

Silicon Photonics OCS: 1000x Faster Switching

  • iPronics silicon photonics OCS reconfigures 1000x faster than previous solutions
  • 32-radix switch ramping in production; 64x64 port OCS chip already fabricated
  • Establishing a Thailand production line, with plans to double radix annually
Abstract
Christian Dupont, CEO of iPronics, presents the company's silicon photonics-based optical circuit switches that achieve reconfiguration times a thousand times faster than previous solutions, enabling rapid network switching for improved reliability and performance in data centers. iPronics is establishing a production line in Thailand to meet volume demands, with their 32-radix switch currently ramping up in production and a 64x64 port OCS chip already fabricated, while planning to double radix annually to improve port density and integration.
Keysight Technologies

Multi-Vendor Ethernet Fabric Proving AI Workload at Scale

  • Keysight demonstrates Ethernet for AI over a multi-vendor fabric network
  • Fabric shown supporting massive AI training and inferencing workloads at scale
Abstract
Vijay Murthy, Senior Technical Product Manager at Keysight Technologies, demonstrates Ethernet for AI at the Ethernet Alliance booth, showing how Ethernet supports massive AI training and inferencing workloads through a multi-vendor fabric network.
Lumentum

Next-Gen Co-Packaged Optics

  • Lumentum demos an 800mW laser in an ELSFP module for co-packaged optics
  • Dual ELSFP system delivers 16 multiplexed channels at 24 dBm fiber coupling
Abstract
Rafik Ward, Chief Strategy Officer & CMO at Lumentum, presents from OFC 2026 showcasing the company's next-generation co-packaged optics technology, including an 800mW laser in an ELSFP module and a dual ELSFP system with 16 multiplexed channels delivering 24 dBm fiber coupling.
Marvell

Marvell's 800G Coherent Light Module

  • Marvell demos the industry's first 800G coherent light module, powered by its Aquila DSP
  • Optimized for O-band campus data center interconnects with links up to 20 km
  • Demo shows strong pre-FEC performance and zero uncorrectable code words
Abstract
Vivek Thyagarajan, Application Engineer at Marvell, demonstrates the industry's first 800G coherent light module powered by Marvell's Aquila DSP, optimized for O-band campus data center interconnects with links up to 20 km. The demonstration shows excellent pre-FEC performance, a clear coherent constellation diagram, and zero uncorrectable code words, confirming clean link operation.
Marvell

1.6T PAM4 TRO Electriccal

  • Marvell demos a 1.6T PAM4 TRRO electrical system with RT DSP at 200 Gbps per lambda
  • Delivers 21 dB output TCQ and 0.995 linearity with wide-open eye patterns
  • Targets high-speed data center, AI networking, and switching fabric interconnects
Abstract
Rittik Shah, Senior Staff Application Engineer at Marvell, demonstrates a 1.6T PAM4 TRRO electrical system at OFC 2025, featuring RT DSP technology operating at 200 Gbps per lambda with 21 dB output TCQ and 0.995 linearity. The demonstration showcases wide open eye patterns designed for high-speed data center, AI networking, and switching fabric interconnect applications.
Nokia

800G Optical Innovation

  • Massive data center buildouts are surging demand for optical networking
  • Diversifying applications require innovative, customer-specific optical solutions
Abstract
Robert Shore, Head of Optical Network Marketing at Nokia, discusses the surging demand for optical networking solutions driven by massive data center buildouts that are diversifying applications and requiring innovative, customer-specific solutions.
Nokia

Connecting AI Clusters Across Multiple Data Center Sites

  • AI expansion beyond single data centers is driving distributed networking across campus sites
  • Nokia 7250 EXR18 half-petabit system delivers 576 ports of 800-gigabit connectivity
  • Enables multiple sites to operate as unified AI clusters
Abstract
Manish Gulyani, SVP and Chief Marketing Officer at Nokia, explains how AI infrastructure expansion beyond single data centers is driving demand for distributed networking across multiple campus sites, with Nokia's 7250 EXR18 half-petabit system delivering 576 ports of 800-gigabit connectivity to enable these sites to operate as unified AI clusters.
Salience Labs

All-Optical Circuit Switches: 2026 the Breakthrough Year?

  • Salience Labs demonstrates a 32-port all-optical switch with a fully non-blocking optical crossbar
  • OCS technology targets rack-level scale-up where traditional solutions fall short
  • Positions 2026 as a breakthrough year for all-optical circuit switching
Abstract
Jim Finch, Vice President of Commercial Strategy at Salience Labs, presents developments in all-optical switches for 2026, highlighting how OCS technology addresses data center scale-up challenges across racks where traditional solutions cannot meet performance demands. Salience Labs demonstrates a 32-port optical switch with a fully non-blocking optical crossbar.
Scintil Photonics

Silicon Photonics: Integrated Lasers & DWDM at Scale

  • Scintil integrates indium phosphide lasers via a proprietary 'backside on box' silicon photonics process
  • External light source combines lasers, muxes, photodiodes, and wavelength references on a single die for DWDM
  • Evaluation kits ship to select customers in Q2; high-volume deployment expected by 2028
Abstract
Matt Crowley, CEO of Scintil Photonics, presents the company's heterogeneous silicon photonics technology that integrates indium phosphide lasers using a proprietary "backside on box" process. The company's external light sources combine lasers, muxes, photodiodes, and wavelength references on a single die to address AI data center demands for dense wavelength division multiplexing, with evaluation kits shipping to select customers in Q2 and high-volume deployment expected by 2028.
VeEX

Why Testing Ensures Market Success

  • VeEX leads the tech team for 800 gig to 10 gig Ethernet interconnects at the Ethernet Alliance Interop
  • Live interoperability demos, planned a year in advance, validate the technology works as intended
  • Interoperability framed as essential to successful market delivery of new technology
Abstract
Keith Cole, GM & VP of Product Marketing at VeEX, leads the tech team for 800 gig to 10 gig Ethernet interconnects at the Ethernet Alliance Interop at OFC, demonstrating successful interoperability testing through live demonstrations planned since the previous year. The testing confirms that interoperability is essential for successful delivery of new technology to the market and validates that the technology works as intended.
VeEX

Solving High-Speed Data Transmission Challenges

  • Ethernet Alliance tackles fast, efficient data delivery via robust testing and verification
  • VeEX participates in the Alliance, positioning Ethernet as a reliable high-speed solution
Abstract
Tim Crawley, Product Marketing Engineer at VeEX, explains how the Ethernet Alliance addresses the critical challenge of delivering data between links quickly and efficiently through robust testing and verification solutions. He emphasizes that as demand for high-speed data transmission increases, Ethernet proves to be a reliable solution, and VeEX's participation in the Alliance.
VIAVI

Viavi's 1.6T Test Platform

  • VIAVI 11600 is a third-gen 1.6 terabit tester, released in 2024
  • Features link training and 1.6 terabit MAC electrical breakout
  • Targets high-scale 1.6T deployment in AI and machine learning ecosystems
Abstract
Paul Brooks, Product Line Manager at VIAVI, presents the company's 11600 1.6 terabit tester, a third-generation platform released in 2024 that has evolved with market scaling toward 1.6 terabit capabilities. The tester features link training and 1.6 terabit MAC electrical breakout, essential for enabling high-scale 1.6 terabit deployment in AI and machine learning ecosystems.
VIAVI

AI Data Centers & 1.6T Testing

  • VIAVI's award-winning D2 enables 802.3dj 1.6T testing with GPU emulation capabilities
  • GPU emulation supports testing next-generation AI application workflows
  • VIAVI collaborating with vendors on 1.6T and Ultra Ethernet interoperability
Abstract
Steve Rumsby, Senior Director of Platform and Architecture at VIAVI, presents the company's award-winning D2 product that enables 802.3dj 1.6T technology with GPU emulation capabilities for testing next-generation AI application workflows. Viavi is collaborating with vendors on interoperability to ensure successful deployment of 1.6T technology and Ultra Ethernet.
VIAVI

1.6Terabit Ethernet Demos

  • 1.6 terabit Ethernet demonstrated using 200G-per-lane technology
  • Multi-vendor demo includes Arista, Cisco, HPE, Keysight, and Teledyne LeCroy equipment
  • Covers DSP-based, LPO, and LRO optical interconnect configurations
Abstract
Dave Estes, Hardware Engineer at VIAVI Solutions, presents demonstrations at the Ethernet Alliance booth at OFC 2025, showcasing the evolution toward 1.6 terabit Ethernet capabilities using 200G per lane technology with equipment from major vendors including Arista, Cisco, HPE, Keysight, Teledyne LeCroy, and others. The demonstrations feature various optical interconnects including DSP-based, LPO, and LRO configurations.
Xscape Photonics

The New Optical Compute Interconnect (OCI)

  • Optical Compute Interconnect (OCI) standardization consortium formed by major tech companies
  • Seen as an important milestone for co-packaged optics in scale-up interconnects
Abstract
Vivek Raghunathan, Co-Founder and CEO of Xscape Photonics, discusses the Optical Compute Interconnect (OCI) standardization consortium formed by major tech companies as an important milestone for co-packaged optics in scaleup interconnects.
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