2024 Showcase

OCP Global Summit Showcase

The Open Compute Project held its annual OCP Global Summit at the San Jose Convention Center from October 15th to 17th, 2024. This year's theme was "From Ideas to Impact." The NextGenInfra team was on site to capture highlights on disaggregated and open ecosystems for the data center, edge, and even the RAN. We appreciate our ongoing partnership with OCP and thank them for letting us capture video at the event. Check out thought leaders talking about the latest in networking, optical, cooling, data center technologies — and GenAI, of course!

While you're here, feel free to check out our previous report on data center networking and infrastructure acceleration covering AI fabrics, SmartNICs/IPUs/DPUs, CXL and other connectivity technologies. We've started work on the 2024 edition, contact us to inquire about sponsoring!

Highlights from industry thought leaders

Video interviews

Astera Labs

Impactful AI Connectivity

  • Astera Labs' Ahmad Danesh names three data center challenges: AI workloads, real-time reasoning, and rapid deployment of new accelerators.
  • Its Ethernet retimers, Smart Fabric switch, and PCIe 6 retimers pair with the Cosmos software stack to improve connectivity and observability.
Abstract
Ahmad Danesh, Sr. Director of Product Management at Astera Labs, outlines three key challenges in data center infrastructure: AI workloads, real-time reasoning, and rapid deployment of new accelerators. Astera Labs addresses these issues through their Ethernet retimers, Smart Fabric switch, and PCIe 6 retimers, combined with their Cosmos software stack to enhance connectivity and observability.
Axiado

Are AI Data Centers Overlooking Security?

  • Axiado CEO Gopi Sirineni argues modern AI servers need built-in, hardware-based security.
  • Its platform root of trust and accelerated computing defend server control and management for AI and x86-based systems.
Abstract
Gopi Reddy Sirineni, CEO of Axiado, discusses the critical need for built-in security in modern computing platforms, especially AI servers. Axiado's hardware-based solutions for server control and management sections utilize platform root of trust and accelerated computing, offering robust defense for AI and x86-based systems.
Broadcom

The Ethernet Path to Scale-Up Networks

  • Broadcom's Ram Velaga notes Ethernet dominates backend networks for GPU clusters of 10,000 to over 100,000 GPUs.
  • He anticipates Ethernet winning scale-up networking within racks on both technical and economic merits.
Abstract
Ram Velaga, GM and SVP of the Core Switching Group at Broadcom, highlights Ethernet's dominance in large GPU clusters for scale-out networking, noting its prevalence in backend networks for clusters of 10,000 to over 100,000 GPUs. Ram anticipates Ethernet's success in scale-up networking within racks, citing its ability to meet requirements and economic advantages.
Carbice

Cracking the Data Center Thermal Challenge with Carbon Nanotubes

  • Carbice's Baratunde Cola introduces vertically aligned carbon nanotube thermal interface materials for data center and AI cooling.
  • They hold consistent performance through thermal cycles, improving energy efficiency and asset longevity.
Abstract
Baratunde Cola, CEO and Founder of Carbice, introduces the company's advanced thermal interface materials, highlighting their potential to enhance cooling in data centers and AI applications. Carbice's vertically aligned carbon nanotubes maintains consistent performance throughout thermal cycles, addressing key issues in energy efficiency and asset longevity.
Dell'Oro Group

The Bright Outlook for Liquid Cooling

  • Dell'Oro's Lucas Beran examines the growing importance of data center liquid cooling.
  • He covers single-phase and two-phase direct-chip cooling plus immersion cooling for high-density AI workloads.
Abstract
Lucas Beran, Principal Analyst at Dell'Oro Group, examines the growing importance of data center liquid cooling technologies. He outlines advancements in single-phase and two-phase direct chip liquid cooling, as well as immersion cooling, to meet the demands of high-density computing and AI workloads.
ECL

Hydrogen Power for Gigawatt Data Centers

  • ECL co-founder Yuval Bachar describes off-grid data centers powered by hydrogen fuel cells.
  • The zero-emission, water-positive microgrid addresses unreliable grid power amid rising AI-driven demand.
Abstract
Yuval Bachar, co-founder and CEO of ECL, catches the NGI crew pre-OCP to discuss ECL's next-generation sustainable data centers powered by hydrogen. ECL addresses the challenge of unreliable grid power and the growing demand for AI-driven data centers by offering an off-grid microgrid powered by hydrogen fuel cells that is zero-emission and water-positive.
IP Infusion

The Future of Scaling Networks is Software

  • IP Infusion's software helped Scott Data scale from 100 Gig to 400 Gig networks on OCP-accepted hardware.
  • Kelly LeBlanc notes the equipment now operates at over 14 terabits per second.
Abstract
Kelly LeBlanc, VP of Marketing at IP Infusion, outlines the company's focus on scaling networks for next-generation data traffic, highlighting their collaboration with Scott Data (data center facilities operator). IP Infusion's solutions, running on OCP-accepted hardware, have enabled Scott Data to scale from 100 Gig to 400 Gig networks, with equipment now operating at over 14 terabits per second.
Marvell

Custom Silicon for Hyperscale Data Centers

  • Marvell's Nigel Alvares details custom silicon co-developed with hyperscalers for optimized performance, power, and cost.
  • He announces Meta's FB NIC, open-sourced to OCP and built on Marvell's 5-nanometer platform.
Abstract
Nigel Alvares, VP of Global Marketing at Marvell, discusses the company's collaboration with hyperscalers to create custom silicon for optimized performance, power, and cost. He announces Meta's release of the FB NIC, a network interface controller, which Marvell has open-sourced to the OCP community, demonstrating the use of Marvell's 5-nanometer platform for tailored silicon solutions.
Marvell

3nm Drives PCIe Gen 7

  • Marvell's Annie Liao discusses PCIe retimers addressing the challenge of rising interconnect speeds.
  • Its Gen 6 and Gen 7 solutions extend trace lengths to support upcoming PCI advancements.
Abstract
Annie Liao, Product Management Director at Marvell, discusses PCI's evolution as a standard protocol for computer system connectivity and the challenges of increasing speeds. Marvell is addressing these challenges with PCI retimers, showcasing Gen 6 and Gen 7 solutions that extend trace lengths and support upcoming advancements in PCI technology.
Multilane

Compressed Dev Cycles for AI Interconnects

  • Multilane's Hani Daou flags compressed demand cycles and interoperability risks in AI compute interconnects.
  • He introduces new high-lane-count testing equipment to ensure comprehensive validation.
Abstract
Hani Daou, Business Development Manager at Multilane, discusses the compute interconnect AI industry's growth and challenges, highlighting compressed demand cycles and potential interoperability issues. To address these concerns, Daou emphasizes the importance of comprehensive testing and introduces Multilane's new generation of equipment for high lane count testing.
Seagate

The Hidden Backbone of AI: Data Storage

  • Seagate's Praveen Viraraghavan stresses that all AI models, checkpoints, and datasets require long-term storage.
  • Hyperscalers, OEMs, and on-premises solutions grow capacity at scale and use data lakes to feed compute clusters.
Abstract
Praveen Viraraghavan, Technologist in the Office of the CTO at Seagate, emphasizes the role of data storage in AI, highlighting that all models, checkpoints, and datasets require long-term storage. Viraraghavan explains that hyperscalers, OEMs, and on-premises solutions are focusing on growing capacity at scale, leveraging storage infrastructures and data lakes to serve data to compute clusters.
Spirent

AI Workload Emulation

  • Spirent's Kevin Chang introduces AI workload emulation that validates AI fabrics without needing actual GPUs.
  • The system integrates the OCP NIC 3.0 form factor to test various system elements and network technologies.
Abstract
Kevin Chang, Engineering Director of Hardware Platforms at Spirent, introduces an AI emulation solution for validating workloads on AI fabrics without needing actual GPUs. Chang showcases a new concept integrating OCP NIC 3.0 form factor into their GPU emulation system, enabling comprehensive testing of various system elements and network technologies.
"Whether or not GenAI lives up to its hype and becomes the operating system for all business and consumer software, it will likely be a primary consumer of data center resources over the next five to ten years."
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