Marvell executives discuss the rapid growth of the hyperscaler market and increasing power consumption in data centers. They highlight Marvell's leadership in customizing accelerated infrastructure for next-generation AI data centers, advancements in optics, and the strength of their portfolio enabling next-gen networking solutions. Featuring Chris Koopmans, Chief Operations Officer; Loi Nguyen, EVP and GM, Optical; Raghib Hussain, President, Products and Technologies; Will Chu, SVP and GM, Custom Compute and Storage BU; Noam Mizrahi, EVP and Corporate CTO; Achyut Shah, SVP and GM, Connectivity; and Nick Kucharewski, SVP and GM, Network Switching.
Marvell Industry Analyst Day Showcase
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Highlights from Marvell Execs at Industry Analyst Day
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Interviews with Marvell Executives at Industry Analyst Day
The following media comprises interviews and other content related to Marvell's Industry Analyst Day 2024. Views expressed are those of the presenting individuals and companies and may not necessarily represent views of Converge! Network Digest or AvidThink. Marvell is a sponsor of NextGenInfra.io
Custom Silicon & Accelerated Infrastructure for AI
Chris Koopmans, Chief Operations Officer, discusses the significant growth of the hyperscaler market and Marvell’s strong position in delivering custom compute and networking solutions for AI and accelerated infrastructure. He emphasizes Marvell’s focus on creating tailored solutions for large customers, aiming to expand market opportunities and develop new capabilities that provide value across diverse applications.
Custom Silicon is the Driver of Optimized AI Infrastructure
Raghib Hussain, President of Products and Technologies, highlights the growing trend of developing optimized AI infrastructure using custom silicon for data centers. Hussain discusses Marvell’s partnerships with major tech giants like Amazon and Meta, emphasizing the value of customization in achieving power and cost savings at scale.
Can it be done? Powering a Million XPUs
Loi Nguyen, EVP and GM of Optical, highlights the enormous power demands of modern data centers and AI clusters, with future “gigawatt-class” facilities requiring energy comparable to major cities. Nguyen discusses the need for multi-site 400k+ node clusters connected by high-speed optics like Marvell’s DCI Optics ZR and ZR+.
Optimizing the Stack for AI Models and Infrastructure
Noam Mizrahi, EVP and Corporate CTO, highlights the contrasting demands in AI between high-performance training and cost-effective inference, emphasizing the necessity for customization to meet diverse requirements. He anticipates that hyperscalers will need to optimize all aspects of their platforms, from accelerator chips to power systems, to achieve effective scaling in the future.
Marvell's Breakthrough High Bandwidth Memory Architecture
Will Chu, SVP and GM of Custom Compute and Storage BU, announces a partnership with major HBM (high bandwidth memory) providers to deliver custom HBM solutions for next-generation AI data centers. This enables significant reductions in power consumption, increased functionality, and improved memory capacity, resulting in better performance and enhanced TCO for Marvell’s customers.
The Future of Co-Packaged Optics Looks Bright
Nick Kucharewski, SVP and GM of Network Switching, highlights co-packaged optics (CPO) as a promising technology for scale-up networking, integrating fiber links directly into product packages for higher speed signals with lower power consumption and latency. Marvell’s light engine provides to 51 Tbps bandwidth for scale-up switches and supports reliable large-scale deployment.
Scaling Networks Beyond the Rack: Choosing the Right Interconnect Technology
Nick Kucharewski, SVP and GM of Network Switching, explores the challenges of expanding networks from rack to row level and the critical role of interconnect technology selection. He outlines key factors for network deployment, including capacity, fault tolerance, and field replaceability.
Introducing "Coherent-Lite" for Data Center Connectivity
Achyut Shah, SVP and GM of Connectivity, introduces the company’s new “coherent-lite” technology, addressing intermediate-reach connectivity needs in data centers. This solution combines coherent modulation with O-band optics and a re-architected DSP to provide lower latency, cost, and power consumption for links ranging from 2 km to 20 km.
PAM Technology: Powering Data Centers Today and Tomorrow
Achyut Shah, SVP and GM of Connectivity, discusses the current dominance of PAM technology in data centers, highlighting its advantages in power efficiency, low latency, and high TCO. Shah predicts that 400 Gig per lane will become the high-volume technology in data centers within a couple of years, with ongoing R&D efforts to extend PAM’s capabilities even further.