Marvell

Will Chu, SVP and GM, Custom Cloud Solutions Business Unit at Marvell, discusses the company's expansion into XPU attach solutions, where Marvell customizes all components within the XPU tray beyond the XPU. The custom solutions include CXL-enabled memory for expansion and near-memory compute, security devices for AI infrastructure management, and high-performance NICs built on Marvell's SerDes and other IP platforms.

In an extended discussion, Rishi Chugh, VP and GM, Data Center Switching at Marvell, shares how AI workloads are driving data center networking, distinguishing between bandwidth-driven scale-out networking (800Gpbs to 1.6Tbps and beyond) and scale-up fabrics that unify xPU pods requiring memory sharing and ultra-low latency. Chugh shares Marvell's commitment to deliver 100T and 200T scale-out fabrics along with 115T and 57T scale-up fabric devices supporting NVLink Fusion, UALink, and ESUN.

Joel Brand, AVP, Product Marketing at Marvell, explains how major wireless vendors are shifting to software differentiation while adopting standardized CPUs and GPUs, creating opportunities for harmonization through initiatives like the Linux Foundation's OCUDu and OCP projects. He highlights that Marvell is uniquely positioned as the only provider of macro-grade merchant silicon to address the industry's economic challenges by moving from custom silicon to market-optimized solutions that offer better cost efficiency and power performance at scale.

Vivek Thyagarajan, Application Engineer at Marvell, demonstrates the industry's first 800G coherent light module powered by Marvell's Aquila DSP, optimized for O-band campus data center interconnects with links up to 20 km. The demonstration shows excellent pre-FEC performance, a clear coherent constellation diagram, and zero uncorrectable code words, confirming clean link operation.

Rittik Shah, Senior Staff Application Engineer at Marvell, demonstrates a 1.6T PAM4 TRRO electrical system at OFC 2025, featuring RT DSP technology operating at 200 Gbps per lambda with 21 dB output TCQ and 0.995 linearity. The demonstration showcases wide open eye patterns designed for high-speed data center, AI networking, and switching fabric interconnect applications.

Noam Mizrahi, EVP and Corporate CTO at Marvell, presents three key predictions for the semiconductor and AI infrastructure landscape in the coming year. He anticipates hybrid electrical-optical connectivity evolving to fully optical by 2027, greater integration of AI capabilities into chip design technologies, and expanded memory capacity beyond traditional HBM through attached or disaggregated architectures.

Mark Kuemerle, VP of Technology and CTO of ASIC Business Unit at Marvell, presented key memory optimization strategies at the AI Infrastructure Summit, focusing on embedded SRAM IP, custom HBM, and the Striker memory aggregation device. These innovations from Marvell enhance data center performance by improving bandwidth and reducing latency across multiple memory types.

Mark Kuemerle, VP of Technology and CTO of ASIC Business Unit at Marvell, presented the company's new die-to-die interface technology at the AI Infrastructure Summit, highlighting its ability to triple bandwidth density while reducing power consumption by 40-70%. The innovative IP block enhances interconnect capabilities between dies and custom HBM, marking a major step forward in data center AI system development.

Annie Liao, Product Management Director at Marvell, presents PCIe Gen 6 retimer solutions and PCIe Gen 7 technology critical for scaling up AI infrastructure. The demonstrations include a three-board PCIe Gen 6 setup with retimer capabilities, and a PCIe Gen 7 system achieving 128G transfer speeds with improved bit error rates through TSMC's 3nm process.

Winnie Wu, Senior Director of Product Marketing at Marvell, describes how data center architectures are adapting to AI server needs through changes in switch placement and rack configurations. She outlines their 7-meter 28-gauge cables supporting 800G breakout connections and their 1.6T product with 32-gauge cables optimized for GPU-to-GPU connectivity.

Will Chu, SVP and GM, Custom Cloud Solutions BU, discusses the company's expansion into XPU attach solutions, where Marvell customizes all components within the XPU tray, including CXL-enabled memory for expansion and near-memory compute, security devices for AI infrastructure management, and high-performance NICs.

Radha Nagarajan, SVP and CTO, Optical and Cloud, outlines three networking architecture categories and how Marvell addresses all three segments through its Celestial acquisition for scale up, internal development for scale out, and an established business in scale across, including 1.6 terabit per second single wavelength links currently in development.

Xi Wang, SVP and GM for Connectivity, introduces the company's RELIANT software suite and Golden Cable program designed to remotely monitor and manage AI infrastructure connecting hundreds of thousands of GPUs and XPUs by collecting data from DSPs in cables and optical modules.

Matt Kim, AVP, Custom Cloud Solutions Business Unit, presents PIVR (Package Integrated Voltage Regulator) technology as a solution to power delivery challenges in the multi-kilowatt chip era where moving voltage regulators directly into the XPU package increases current density performance by up to 2x and reduces power transmission losses by as much as 85%.

Annie Liao, Product Management Director outlines Marvell's PCIe retimer product roadmap from generations 5.0 through 8.0, explaining how current electrical solutions will face increasing challenges at higher data rates of 128 and 256 Gbps per lane. She describes their strategic development of optical PCIe solutions, including partnerships for optical modules and cables as well as in-house co-packaged optics (CPO) technology.

Rishi Chugh, VP and GM, Data Center Switching at Marvell, joins Roy Chua, Principal and Founder of AvidThink, to explore how AI workloads are fundamentally changing data center networking by demanding flatter architectures and unprecedented levels of reliability. The discussion covers how AI training's massive power consumption and time requirements make network failures extremely costly, driving the industry to reconsider traditional Ethernet approaches and adopt more complex designs with distinct front-end and backend networks.

Joel Brand, AVP of Product Marketing at Marvell, explains that AI in wireless networks is currently more hype than reality, despite its success in data centers. His insights highlight how Marvell's AI-capable baseband devices allow customers to test algorithms in real networks.

Kishore Atreya, Sr. Director, Platform Product Management at Marvell, presents the company's co-packaged optics reference platform featuring a liquid-cooled 1 OU system with 16 6.4T light engines that integrate silicon photonics technology for electrical-to-optical signal conversion. He addresses the significant deployment challenge of managing over 36,000 fibers when scaling to 32 units per rack, emphasizing the need for industry solutions in backplane design and fiber routing for successful rack-level implementation.

Khurram Malik, Sr. Director, Product Marketing, CXL at Marvell, presents the company's Structura CXL product portfolio designed to address growing memory capacity and compute power demands. The portfolio includes Structura A with 16 ARM core processors for deep learning and inference workloads, and Structura X for memory expansion solutions that enable hyperscalers to combine DDR4 and DDR5 memory with compression algorithms.

George Hervey, Principal Architect at Marvell, showcases an innovative co-packaged copper design for switch trays that enhances passive copper performance through substrate-mounted flyover wires and 224G compatibility. The liquid-cooled solution enables direct XPU ASIC to CPO engine connections and supports large-scale multi-rack compute clusters up to 2,000 nodes with a single switching layer.

Matt Traverso, Distinguished Engineer at Marvell, leads research on high-density 2D connector designs to enhance 448G signaling capabilities for AI and large-scale computing. His work prioritizes signal integrity optimization and thermal efficiency to create lossless electrical channels for next-generation data centers.

Nigel Alvares, VP of Global Marketing at Marvell, outlines three major data center predictions, including cloud providers moving to fully custom infrastructure and the evolution of AI cluster configurations — growing AI workloads will push organizations to adopt multi-site data centers with enhanced interconnect capabilities.

Loi Nguyen, EVP and GM of Optical, highlights the enormous power demands of modern data centers and AI clusters, with future "gigawatt-class" facilities requiring energy comparable to major cities. Nguyen discusses the need for multi-site 400k+ node clusters connected by high-speed optics like Marvell's DCI Optics ZR and ZR+.

Nick Kucharewski, SVP and GM of Network Switching, highlights co-packaged optics (CPO) as a promising technology for scale-up networking, integrating fiber links directly into product packages for higher speed signals with lower power consumption and latency. Marvell's light engine provides to 51 Tbps bandwidth for scale-up switches and supports reliable large-scale deployment.

Achyut Shah, SVP and GM of Connectivity, introduces the company's new "coherent-lite" technology, addressing intermediate-reach connectivity needs in data centers. This solution combines coherent modulation with O-band optics and a re-architected DSP to provide lower latency, cost, and power consumption for links ranging from 2 km to 20 km.

Chris Koopmans, Chief Operations Officer, discusses the significant growth of the hyperscaler market and Marvell's strong position in delivering custom compute and networking solutions for AI and accelerated infrastructure. He emphasizes Marvell's focus on creating tailored solutions for large customers, aiming to expand market opportunities and develop new capabilities that provide value across diverse applications.

Achyut Shah, SVP and GM of Connectivity, discusses the current dominance of PAM technology in data centers, highlighting its advantages in power efficiency, low latency, and high TCO. Shah predicts that 400 Gig per lane will become the high-volume technology in data centers within a couple of years, with ongoing R&D efforts to extend PAM's capabilities even further.

Raghib Hussain, President of Products and Technologies, highlights the growing trend of developing optimized AI infrastructure using custom silicon for data centers. Hussain discusses Marvell's partnerships with major tech giants like Amazon and Meta, emphasizing the value of customization in achieving power and cost savings at scale.

Noam Mizrahi, EVP and Corporate CTO, highlights the contrasting demands in AI between high-performance training and cost-effective inference, emphasizing the necessity for customization to meet diverse requirements. He anticipates that hyperscalers will need to optimize all aspects of their platforms, from accelerator chips to power systems, to achieve effective scaling in the future.

Nick Kucharewski, SVP and GM of Network Switching, explores the challenges of expanding networks from rack to row level and the critical role of interconnect technology selection. He outlines key factors for network deployment, including capacity, fault tolerance, and field replaceability.

Will Chu, SVP and GM of Custom Compute and Storage BU, announces a partnership with major HBM (high bandwidth memory) providers to deliver custom HBM solutions for next-generation AI data centers. This enables significant reductions in power consumption, increased functionality, and improved memory capacity, resulting in better performance and enhanced TCO for Marvell's customers.

Joel Brand, Senior Director of Product Marketing at Marvell, discusses the integration of AI into their Octeon product line, used by major companies like Nokia and Samsung, and utilized in about 50% of base stations outside China. Marvell has embedded an AI accelerator, or NPU, into the Octeon line, which is exposed to the broader development community via the Apache TVM project, allowing the use of standard open-source tools to innovate directly on the radio Access Network, potentially driving incremental revenue in the Telco environment.

Nigel Alvares, VP of Global Marketing at Marvell, discusses the company's collaboration with hyperscalers to create custom silicon for optimized performance, power, and cost. He announces Meta's release of the FB NIC, a network interface controller, which Marvell has open-sourced to the OCP community, demonstrating the use of Marvell's 5-nanometer platform for tailored silicon solutions.

Annie Liao, Product Management Director at Marvell, discusses PCI's evolution as a standard protocol for computer system connectivity and the challenges of increasing speeds. Marvell is addressing these challenges with PCI retimers, showcasing Gen 6 and Gen 7 solutions that extend trace lengths and support upcoming advancements in PCI technology.

Marvell VP of Product Marketing, Xi Wang, highlighted the rising demand for optical connectivity in AI cluster. Marvell has introduced a new product, Spica Gen2-T, a transmit-only DSP that enables a new type of optical module, the Transmit Retimed Optical (TRO) module, which can reduce power consumption by 40% while ensuring flexibility and scalability.

Stephen Adolph, AVP of CDSP Product Line Management at Marvell, introduces Orion DSP that uses probabilistic constellation shaping (PCS), crucial for hyperscale network operators needing increased network distance. PCS extends 800G reach to over 1,000 km, an improvement over 800G ZR+ at 500 km.

Loi Nguyen, EVP and GM of Optical at Marvell, unveiled their 3D SiPho engine, a silicon photonics engine that delivers 6.4 Tbps, enhancing speeds for AI applications. Featuring 200G I/O, the 3D SiPho Engine delivers 2x the bandwidth and input/output (I/O) bandwidth density, and 30% lower power per bit versus devices with 100 Gbps electrical and optical interfaces.

George Hervey, Principal Architect at Marvell, showcased their AI infrastructure solutions: a 51 Tbps switch, 800G AEC cables, and 800G optics for low-latency switching. The demonstration also highlighted a 51 Tbps platform with a liquid cooling option and another 51 Tbps platform using 64 800G OSFP modules.

Marvell's Vice President of Product Marketing, Xi Wang, unveiled a new product, Nova 2 designed to address the shift to 200G. Nova 2, an optical DSP, facilitates the construction of 1.6 Tbps optical transceiver modules, enhancing connectivity and computing power for next-generation AI.

George Hervey, Principal Architect at Marvell, showcased their AI infrastructure solutions: a 51 Tbps switch, 800G AEC cables, and 800G optics for low-latency switching. The demonstration also highlighted a 51 Tbps platform with a liquid cooling option and another 51 Tbps platform using 64 800G OSFP modules.

Noam Mizrahi, EVP and Corporate CTO at Marvell, forecasts the growth of larger and more demanding AI clusters will require higher bandwidth connectivity and the development of ultra-complex custom silicon ASICs, optimized for specific use cases. Mizrahi also predicts a shift from training AI models to inference, necessitating a more optimized infrastructure with unique network features.

Radha Nagarajan, SVP and CTO of Optical and Cloud at Marvell, emphasized the importance of optical connectivity in managing data transport as AI clusters increase in size. With the introduction of a 1.6 DSP for the 1.60 generation, Marvell is ready to meet the growing demand for optical connectivity solutions in AI-centric data centers.

Joel Brand, Senior Director of Product Marketing at Marvell, observed an increased participation from India and Asia, a growing interest in AI and machine learning, and a larger presence of hyperscalers at the Mobile World Congress. He also noted prevalent discussions around cloud integration, attracting many new cloud players to the event, and expressed anticipation for the continued evolution of the industry.

Radha Nagarajan, SVP and CTO of Optical and Cloud at Marvell, highlighted the company's new 800 Gbps ZR/ZR+ coherent pluggable module designed to enhance data center connectivity by converting a switch or router into a transport platform. The module, which leverages Marvell's capabilities at 800 gig, including the DSP, high-speed TIAs, drivers, and silicon photonics, enables a single fiber capacity of 25.6 terabits between data centers, facilitating larger data aggregation.

Hyperscalers are leading forces for innovation. What new technologies are on tap for cloud infrastructure in 2023? Marvell's Nigel Alvares makes his predictions for what's next on cloud infrastructure in 2023.

In the drive toward O-RAN and v-RAN, silicon vendors are racing toward smaller geometries, and Marvell is on the leading edge with portfolio optimized for the RU, DU and now the virtualized DU, says Joel Brand, Senior Director, Product Marketing, Marvell. The idea with the virtualized DU is to process some of the functionality in a host server leveraging cloud technologies and a new generation of accelerator cards powered by dedicated silicon. Download AvidThink's MWC 2022 Report Collection to explore exclusive insights and research findings on hot topics covered at MWC 2022.

Joel Brand, Senior Director, Product Marketing at Marvell, shares predictions for 2022. Download AvidThink's 2021 Select Report Collection to explore strategies and opportunities in the Telco, Private Mobile Networks, Service Assurance, SD-WAN and Open RAN space.

Will Chu, SVP & General Manager, Automotive at Marvell, shares predictions for 2022. Download AvidThink's 2021 Select Report Collection to explore strategies and opportunities in the Telco, Private Mobile Networks, Service Assurance, SD-WAN and Open RAN space.

Nigel Alvares, Vice President of Solutions Marketing at Marvell, shares predictions for 2022. Download AvidThink's 2021 Select Report Collection to explore strategies and opportunities in the Telco, Private Mobile Networks, Service Assurance, SD-WAN and Open RAN space.

Radha Nagarajan, SVP & CTO, Optical & Copper Connectivity at Marvell, shares predictions for 2022. Download AvidThink's 2021 Select Report Collection to explore strategies and opportunities in the Telco, Private Mobile Networks, Service Assurance, SD-WAN and Open RAN space.

As networks become more virtualized, both at the far edge and near edge, Open RAN is drawing more interest and participation from hyperscalers. In this video, Raj Singh, EVP Processor Business Group at Marvell, discusses the opportunities Open RAN offers networks and the emerging trends in the market. Download AvidThink's 2021 Open RAN Report to explore key infrastructure considerations for Open RAN and O-RAN adoption.