Broadcom

Hasan Siraj, VP of Product Management for the Core Switching Group at Broadcom, explains how Ethernet has become the industry standard for AI networking at scale, enabling clusters of over 100,000 XPUs through scale-up, scale-out, and scale-across architectures. He discuses Broadcom's solution portfolio including: Tomahawk Ultra, Tomahawk 6, Thor Ultra and Jericho 4.

Near Margalit, GM and VP of Optical Systems Division at Broadcom, presents the newly released OCI MSA optical standard for scale-up networks at OFC26, which reduces latency, power, and cost by utilizing wavelength division technology with four colors of light in each direction instead of high-speed serial PAM 4 lanes.

Manish Mehta, VP Marketing, Optical Systems Division at Broadcom, discusses the company's co-packaged optics (CPO) technology demonstrated at OFC, including Meta's announcement of trials achieving 50 million hours of link flap-free operation. He explains that CPO's highly integrated architecture and high-volume manufacturing processes deliver extremely reliable optical links with superior RAS performance.

Hasan Siraj, VP of Product Management in the Core Switching Group at Broadcom, highlights the Ethernet for Scale-Up Networking Group's 1.0 specification and rack expansion from 64-128 XPUs to 1K XPUs. He also announces Tomahawk 6 shipping in volume production as the first to support 64 ports of 1.6Tbps with 200G SerDes and CPO, the company's participation in the OCI MSA, and the new Jericho 4 enabling cross-data center cluster deployment.

Gang Qiu, Product Line Manager, Marketing at Broadcom, presents Taurus, the industry's first 400 gigabit per lambda PAM4 optical DSP designed to help customers scale AI infrastructure at OFC 2026. The solution enables next-generation low-cost, low-power 1.6 terabit transceivers and paves the path to 3.2 terabit transceivers in 200 terabit switch networking systems.

Harish Bharadwaj, VP of Marketing for the ASIC Product Division at Broadcom, discusses the company's 3.5D silicon technology that stacks two compute dies face-to-face on an interposer, advancing beyond the industry's standard 2.5D approach. Broadcom is now shipping its first 3.5D product to Fujitsu, with the technology being adopted across all major XPU partners.

Hasan Siraj, Head of Software Products/Ecosystem at Broadcom, presents three networking predictions for 2026 centered on AI infrastructure, including Ethernet becoming the standard for scale-up networking, AI clusters expanding across multiple data centers with Ethernet as the interconnecting fabric, and co-packaged optics going mainstream due to 70% power efficiency gains. Broadcom is investing heavily in these technologies while collaborating with customers and partners to enable these infrastructure transitions.

Ram Velaga, GM and SVP of Core Switching Group at Broadcom, discusses how networking must evolve to support expanding AI infrastructure and machine learning systems across multiple scaling domains in data centers. He explains why Ethernet technology stands out as the optimal networking solution for AI infrastructure, highlighting its clean interface, proven reliability, and consistent bandwidth improvements that align with industry needs.

Manish Mehta, VP Marketing, Optical Systems Division at Broadcom, discusses the explosive demand for AI innovation and the need for collaborative forums like OCP to unite community partners at the Open Compute Summit in San Jose. He highlights Broadcom's contributions to next-generation AI networks through rack scale architectures with Celestica, ESON partnerships, and optical innovations that provide hyperscalers with confidence in innovation velocity and supply reliability.

Manish Mehta, VP Marketing, Optical Systems Division of Broadcom, presents the company's optical interconnect advances for AI networks at OFC, including their groundbreaking 200Gbps per lane VCSEL technology and production-ready EML laser solutions. The presentation showcases how Broadcom's co-packaged optics reduce power usage by 70% while enabling enhanced integration through the Tomahawk 5 Bailly 51T Ethernet switch connected to Thor 2 NIC and XPU-to-switch optical connectivity solutions.

Pete Del Vecchio, Data Center Switch Product Line Manager at Broadcom, shares his vision for 2025, highlighting Ethernet's dominance in GPU clusters and scale-up networking. His analysis points to a future where AI deployment becomes more accessible through efficient processors and networking solutions, enabling organizations of all sizes to implement large language models.

Pete Del Vecchio, Data Center Switch Product Line Manager at Broadcom, presents at the Technology Exploration Forum for Internet Alliance 2025, highlighting how the event uniquely brings together the entire AI infrastructure ecosystem to address the massive scale of modern data centers, with some reaching 5 gigawatts and multi-million GPU clusters. He emphasizes the comprehensive optimization approach being applied across all components, from nanometer-scale silicon transistors to racks, as the industry collaborates to enable next-generation AI infrastructure capable of supporting systems the size of Manhattan.

Ram Velaga, GM and SVP of the Core Switching Group at Broadcom, highlights Ethernet's dominance in large GPU clusters for scale-out networking, noting its prevalence in backend networks for clusters of 10,000 to over 100,000 GPUs. Ram anticipates Ethernet's success in scale-up networking within racks, citing its ability to meet requirements and economic advantages.

Manish Mehta, VP Marketing of Broadcom's Optical Systems Division, discusses the company's advancements in optical components, including the development of terabit transceivers and plans to showcase 200G EMLs and 200G VCSELs for use in 1.6 Tbps transceivers.

Kamran Naqvi, Principal Network Architect at Broadcom, discussed the company's efforts to democratize networking by making features previously exclusive to hyperscalers available to all users, including the Sonic software, an open-source network operating system. Broadcom has enhanced Sonic to be more enterprise-class, leading to increased adoption among enterprise customers, and has enabled silicon telemetry features in its silicon, which can help customers quickly identify the root cause of network or application performance issues.

Broadcom's GM and VP of Optical Systems Division, Near Margalit, announced that the company has successfully tackled the main technical challenges of deploying CPO switches and is now focusing on demonstrating the reliability and cost-effectiveness of the core silicon photonics technology. Margalit also addressed concerns about the reliability of the laser component and the time to market, stating that Broadcom is working to shorten the time between the availability of CPO technology for integration with the switch and its market launch.

Henry Wu, Technical Director at Broadcom, unveils the Qumran3D, the industry's first 5-nanometer 25.6 terabit router chip, offering up to 66% power savings and 80% router space reduction. The device, designed to combat cybersecurity threats, supports high-speed, high-density port interfaces up to 800GE leveraging best-in-class 100Gb/s PAM-4 SerDes. The design also enables massive on chip forwarding databases, eliminating the need for companion devices

Helen Burke, Solution Architect from Broadcom highlights the importance of monitoring SD-WAN environments and discusses best practices to ensure customers are getting value from deployments. Burke also touches on how to integrate SD-WAN deployments with existing operational workflows.

The NGCO is an amazing opportunity and a confluence of vision and product development, says Rochan Sankar, Senior Director, Switch Products, Broadcom. NGCO requires virtualization and cloudification of the underlying network. The Ethernet-based interconnects for this infrastructure presents many opportunities for innovation.