Ayar Labs
Executive perspectives from Ayar Labs across NextGenInfra's event and research showcases.
5 video interviews · 2024–2026
Scaling Beyond Power Constraints with CPO
- Co-packaged optics is Ayar Labs' answer to rising token demand under hard power constraints, backed by more than $650M raised this year.
- The ecosystem on show spans TSMC silicon photonics wafers, multi-chip packages with Alchip and GUC, external laser sources, and fiber connectors from Broadcom, Foscy, and Senko.
- Multi-source supply is the precondition for high-volume production, with Wiwynn as strategic partner and investor for hyperscale deployment.
Abstract
Vishal Chandrasekar, Director of Product Management at Ayar Labs, discusses how co-packaged optics addresses AI token generation demands amid power constraints, noting the company raised over $650 million and hosted a CPO summit on scale-up solutions and the OCI MSA. He showcases Ayar Labs' ecosystem including optical engines on TSMC's silicon photonics platform, multi-chip packages with partners like Alchip and GUC, external laser sources, fiber connectors from Broadcom, Foscy, and Senko, plus strategic partner Wiwynn for hyperscale data center deployment.
Optical Interconnects for AI
- Optical engines fabricated on TSMC's platform; multi-chip packages integrate eight engines to replace copper
- Chip-to-system approach scales both GPU and switch connectivity
- Partner ecosystem (FOCI, Browave, Wiwynn, Alchip, GUC) targets 2028 deployment
Abstract
Vishal Chandrasekar, Director of Product Management at Ayar Labs, presents an optical interconnect solution that scales GPU and switch connectivity through a chip-to-system approach, featuring optical engines fabricated on TSMC's platform and multi-chip packages that integrate eight optical engines to replace copper implementations. The solution, developed with partners including FOCI, Browave, Wiwynn, Alchip, and GUC, targets 2028 deployment.
Co-Packaged Optics Demo in a Liquid-Cooled Rack
- Ayar Labs, Wiwynn and Corning show an upgraded optical scale-up rack aimed at proving co-packaged optics can be built and delivered reliably at scale.
- It is the first live rack demo of Ayar Labs' TSMC COUPE-based optical engines, integrated with GPU and HBM in GUC multi-chip packages for more than 200 Tbps of scale-up bandwidth.
- Hours of fully liquid-cooled operation show stable micro-rings, lasers held near 50°C, and all components within their temperature ranges.
Abstract
At the OCP Global Summit, Vishal Chandrasekar, Director of Product Management at Ayar Labs, presents an upgraded optical scale-up rack built with Wiwynn and Corning, featuring the company's first live demonstration of TSMC COUPE-based optical engines in multi-chip packages developed with GUC that deliver more than 200 Tbps of scale-up bandwidth. The fully liquid-cooled demo shows stable micro-ring resonators and well-controlled thermal profiles over many hours, demonstrating that co-packaged optics can be manufactured and deployed reliably at data center rack scale.
Ayar Labs CTO on Optical I/O for AI Networks
- Ayar Labs' optical IO connects GPUs across multi-rack clusters for AI inference.
- Claims 10-20x better performance per watt versus traditional copper IO.
- Enables direct extended memory connections beyond the rack.
Abstract
Vladimir Stojanovic, CTO & Co-Founder of Ayar Labs, outlines the company's optical IO technology that addresses GPU scaling challenges in AI inference workloads by enabling connectivity across multi-rack GPU clusters. The solution achieves 10-20x better performance per watt while supporting direct extended memory connections, marking a significant advance over traditional copper IO approaches.
Moving Data at the Speed of AI
- Ayar Labs CEO Mark Wade presented optical I/O advances aimed at next-generation AI systems.
Abstract
Mark Wade, CEO and Co-founder of Ayar Labs, shares the latest in optical I/O for next-gen AI systems.