Phononic
Executive perspectives from Phononic across NextGenInfra's event and research showcases.
1 video interview · 2026
Managing Heat at Die Level for Maximum GPU Output
- Phononic applies thermal control at the die level for GPU and networking partners, rather than at the rack or the room.
- The cooling infrastructure layers onto existing liquid cooling instead of replacing it.
- Software control over that layer is what converts cooling headroom into more tokens per megawatt.
Abstract
Ryan Brown, Director of Product Management at Phononic, presents at the AI Infrastructure Summit on thermal control solutions that manage heat at the die level for GPU and networking partners. Phononic's cooling infrastructure integrates with existing liquid cooling systems and provides software control to maximize output and achieve more tokens per megawatt.