Flex
Executive perspectives from Flex across NextGenInfra's event and research showcases.
2 video interviews · 2026
Grid to Rack as One Power System
- Flex spans grid-level power through rack and board power to integrated rack and server manufacturing, so customers can treat the data center as one system.
- A new pre-manufactured, payload-agnostic AI reference platform cuts deployment times by up to 50%.
- The EPC Power acquisition converts 34.5 kV straight to 800 V DC for roughly five points of efficiency gain, with solid-state transformers adding one to two more.
Abstract
Chris Butler, President, Embedded and Critical Power at Flex, explains how Flex brings a system-level approach to the OCP community through a portfolio spanning utility-level power, power distribution, rack and board-level power, and integrated rack and server manufacturing, letting customers treat the data center as a single system for better efficiency, faster deployment, and modular construction. He highlights a new pre-manufactured, payload-agnostic AI reference platform that shortens deployment times by up to 50% and the acquisition of EPC Power, whose direct 34.5 kV-to-800-volt DC conversion yields roughly five points of efficiency gain, with solid-state transformer technology on the roadmap adding at least another one to two points.
200-Terabit Optical Switch: Collaboration Advances AI Networking
- Lightmatter and Flex built a 1RU, 200-terabit optical switch through an OCP workstream, pairing a dense laser system and all-optical connectivity with Flex's modular fiber attach units and fiber trays.
- The work has moved from a contributed white paper to prescriptive specifications covering fiber connectors, optical loss, and other critical parameters.
- The prototype is a test vehicle for building supply-chain know-how with partners such as Senko (connectors) and JetCool (liquid cooling), and both companies invite wider participation in the OCP work group.
Abstract
Bijan Nowroozi, Head of Ecosystem Development at Lightmatter, and Janos Veres, Senior Director, Assembly & Test Technologies at Flex, present a collaborative 1RU, 200-terabit optical switch developed through their OCP workstream that advances AI networking infrastructure with high-density photonics and modular architecture. The project has evolved from a white paper to developing prescriptive specifications for fiber connectors and critical parameters, with the current prototype serving as a test vehicle to build supply chain understanding among partners including Lightmatter, Flex, Senko, and JetCool.