Alphawave Semi
Executive perspectives from Alphawave Semi across NextGenInfra's event and research showcases.
5 video interviews · 2024–2025
Use Cases for Chiplets in AI Clusters
- AI demand plus maturing die-to-die interface standards are the twin drivers accelerating chiplet adoption.
- Three chiplet use cases: compute-to-compute (high bandwidth, low latency), compute-to-IO for extended connectivity, and compute-to-optics.
- Compute-to-optical interfacing targets long-distance communication across AI clusters.
Full summary
Tony Chan Carusone, Chief Technology Officer at Alphawave Semi, discusses how AI demand and maturing die-to-die interface standards are accelerating chiplet adoption. He outlines three main applications: connecting compute chiplets with high bandwidth and low latency, linking compute cores to IO chiplets for extended connectivity, and interfacing compute chiplets with optical components for long-distance AI cluster communication.
The Race to 400G per Lane and Beyond
- 400Gig-class signaling takes center stage in AI network scaling.
- Traditional PAM modulation must be reassessed at higher speeds.
- New optical devices, advanced packaging, and coherent optics expand into shorter-reach applications.
Full summary
Michael Klempa, Product Marketing Engineer at Alphawave Semi, forecasts that 2025 will bring specialized AI hardware and increased connectivity demands, with 400Gig-class signaling taking center stage in AI network scaling. He highlights the need to reassess traditional technologies like PAM modulation at higher speeds while anticipating new optical devices, advanced packaging solutions, and the expansion of coherent optical connectivity into shorter-reach applications.
OIF's demos at OFC 2024
- OIF's OFC 2024 interoperability demonstration featured nearly 50 participating companies.
- The event showcased the first multivendor interop with 800ZR modules, aiming to deliver more data at lower power.
Full summary
Mike Klempa, Product Marketing specialist at Alphawave Semi and chair of the OIF's PLL interoperability working group, announces the OIF's interoperability demonstration at OFC 2024 featuring nearly 50 participating companies. The event showcased the first multivendor interoperability demonstration with 800 ZR modules, aiming to deliver more data at lower power.
AI Chiplets and Optical Communications
- Alphawave Semi's Tony Chan Carusone predicts AI capabilities enhanced through customized hardware with chiplets.
- He forecasts a surge in hardware demand and a growing number of semiconductor companies.
Full summary
Tony Chan Carusone, Chief Technology Officer for Alphawave Semi, predicts AI capabilities will be enhanced through the deployment of customized hardware with chiplets, a surge in demand for hardware, and an increase in semiconductor companies.
Unlocking AI's Potential: Connectivity and Collaboration
- Alphawave Semi stresses connectivity and industry collaboration as key to advancing AI technologies.
- Alphawave contributes chiplets, custom silicon, and die-to-die IP and transceivers for AI processor connectivity.
Full summary
Tony Chan Carusone, Chief Technology Officer of Alphawave Semi, emphasizes the importance of connectivity and industry collaboration in advancing AI technologies across multiple fronts. He highlights Alphawave Semi's contributions in chiplets and high-speed series technologies, including custom silicon solutions and IP offerings for die-to-die interfaces and transceivers for AI processor connectivity.