UCIe Consortium
Executive perspectives from UCIe Consortium across NextGenInfra's event and research showcases.
1 video interview · 2026
UCIe Chiplet Connectivity for Performance & Efficiency
- UCIe connects chiplets in-package and package-to-package, including over co-packaged optics
- Bandwidth density is 1-4 orders of magnitude better than PCIe or Ethernet
- Enables composable systems with dynamic resource allocation
Full summary
Debendra Das Sharma, UCIe Consortium Chair at UCIe Consortium, explains how UCIe technology enables chiplet connectivity within packages and package-to-package connections using co-packaged optics for composable systems with dynamic resource allocation. UCIe delivers bandwidth densities with 1-4 orders of magnitude improvement over PCIe and Ethernet.