Ranovus
Executive perspectives from Ranovus across NextGenInfra's event and research showcases.
2 video interviews · 2024–2025
Wafer-Scale CPO + Wafer-Scale AI Computing
- Ranovus CEO Hamid Arabzadeh details wafer-scale co-package optics spanning multiple GPUs.
- Delivers significantly higher capacity than traditional solutions while addressing power and cost.
- Developed with Cerebras and backed by a DARPA contract.
Full summary
Hamid Arabzadeh, CEO of Ranovus, details their wafer-scale co-package optics technology that enables optical interfaces across multiple GPUs, delivering significantly higher capacity than traditional solutions. The technology, developed through collaboration with Cerebras and backed by a DARPA contract, addresses key power and cost challenges while providing superior interconnect capabilities for AI compute platforms.
Co-Package Optics (CPO) Takes a Huge Step Forward
- Ranovus cited co-package optics investment from TSMC, Nvidia, Broadcom, AMD/Xilinx, SilTerra, and Mediatech.
- Ranovus introduced a new generation of co-package optics with a self-contained optical engine.
Full summary
Hamid Arabzadeh, CEO of Ranovus, discusses the growth of co-package optics and the significant investment by industry giants such as TSMC, Nvidia, Broadcom, AMD/Xilinx, SilTerra, and Mediatech. Arabzadeh highlights the company's new generation of co-package optics that includes a self-contained optical engine.