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Iceotope

Executive perspectives from Iceotope across NextGenInfra's event and research showcases.

1 video interview · 2025

2025 OCP Global Summit Iceotope

100% Heat Capture for High-Power AI Infrastructure

  • Iceotope uses dielectric fluids and cold plates to capture 100% of thermal load.
  • Cutting cooling energy frees more power for GPUs and compute.
  • The approach targets thermal challenges from 1 MW racks and 8 kW chips.
Full summary
Neil Edmunds, VP of Product Management at Iceotope, presents advanced thermal management solutions at OCP 2025 that use dielectric fluids and cold plates to capture 100% of thermal load from high-power AI infrastructure, reducing cooling energy consumption. The Iceotope approach enables data centers to allocate more power to GPUs and compute resources while efficiently managing thermal challenges from 1 megawatt racks and 8 kW chips.