Dust Photonics
Executive perspectives from Dust Photonics across NextGenInfra's event and research showcases.
1 video interview · 2024
Rethinking Optical Modules for Liquid Immersion
- Dust Photonics' Carmel-8-IMC transmit chip uses no free-space optics, butt-coupling lasers directly to the PIC.
- Attaching fiber directly to the PIC enables transceiver designs usable for both immersion and air cooling.
Full summary
DustPhotonics’ transmit Carmel-8-IMC chip supports an optical assembly with no free-space optics. Inside the chip, lasers are butt-coupled to the PIC and the fiber is also attached directly to the PIC, thus enabling transceiver designs that can be used for both immersion and air cooling. Ronnen Lovinger, CEO of Dust Photonics, shares a demo.